Meeting Notice

The Southeastern Michigan IEEE EMC Society presents:

Engineering Aspects of PCB Level EMC Design

Speaker:  Dr. Sergiu Radu

Date: September 16, 2010

Time: 5:30 PM

Location: Fairlane Campus - U of M Dearborn (Map Code FCN)

University of Michigan
School of Management
Fairlane Center
North - Room TBD
19000 Hubbard Drive
Dearborn, MI 48126

Driving Directions

Please pre-register for this free event online at:

 

https://www.ieeeemcs.org/semi/regemcmeet.asp?EventID=091610

 

 

Deadline: Noon on the day prior to the event

Schedule of Events

 

5:30 – 6:00 Pizza and Refreshments provided by:  Intermark  toshi.mukai@mukaiandco.com

 

 

 

6:00 – 7:00 Presentation

 
 
The Chapter Presentation is a FREE event.  IEEE Non-Members Welcome!

To be added or removed from the IEEE EMC e-mailing list, send an email to scott@emcsociety.org with ADD or REMOVE in subject line.

The IEEE Southeastern Michigan EMC Homepage is http://www.emcsociety.org/

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Abstract:  Engineering Aspects of PCB Level EMC Design

    • Engineering Aspects of PCB Level EMC Design

      The PCB design is a complex cooperation between electrical, mechanical, thermal, SI,
      PI and EMC design. In a practical design, the EMC design engineer has to make trade-offs and understand the relative impact of different design choices. The lecture is an overview of the typical PCB design aspects and their role for the EMC performance. Among the aspects discussed are placement, stack-up, routing, decoupling, and grounding aspects. The design of the I/O ports , in order to pass the emissions and immunity tests is also discussed in greater detail.

      Outline:
      1. Introduction - what matters for EMI
      2. Stack-up principles and practical examples
      3. Placement - potential EMI impact
      4. Routing aspects which may impact EMI
      5. Decoupling: power engineering, SI and EMI approaches.
      6. Grounding scheme and exceptions, heatsink grounding
      7. Stitching
      8. Spread spectrum use and limits
      9. Ethernet port
      10. USB port
      11. Serial port
      12. Serial buses (PCIe, SAS/SATA, IB) and EMI impact


Dr. Sergiu Radu is currently Principal Engineer at Sun Microsystems, leading the EMC Design group in Menlo Park, California. His role at Sun includes the development and implementation of architectural frameworks for EMC Design through design guidelines and best practices, and to provide forward looking solutions, root cause analysis of significant EMC problems, design methodologies involving software simulations and better prediction techniques. Sergiu Radu received a M.S. and a Ph.D. in Electrical Engineering (Electronics) from Technical University of Iasi, Romania, and until 1996 he was an Associate Professor at the same university, involved in Electromagnetic Compatibility teaching and research. From 1996 until 1998 he was a Visiting Scholar at the University of Missouri-Rolla, as part of the Electromagnetic Compatibility Laboratory. In 1998 he joined the EMC Engineering group at Sun Microsystems. Sergiu holds seven US patents for EMI reduction techniques in electronic systems and has published more than 50 papers in research journals, symposia, and magazines. He is a reviewer for IEEE Transactions on EMC. He is also a distinguished lecturer for the IEEE EMC Society.

 

 

Dr. Sergiu Radu

 

To be added or removed from the Southeastern Michigan IEEE EMC Society email list, just send an email to scott@emcsociety.org with ADD or REMOVE as the subject line.

The IEEE Southeastern Michigan EMC Homepage is http://www.emcsociety.org